Qualcomm Launches AI-Ready IoT Platform at Embedded World 2024

Qualcomm has unveiled its new AI-compatible IoT platforms at this year’s Embedded World, taking place this week, April 9-11 in Nuremberg, Germany. 

The Qualcomm RB3 Gen 2 Platform is designed for IoT and embedded applications and is compatible with AI, computer vision and camera sensors. Potential applications include robots, drones, industrial handheld devices, and industrial and connected cameras.

"The RB3 Gen 2 Platform…is designed to bring advanced on-device AI capabilities to a wide range of mid-tier IoT applications,” said Jeff Torrance, Qualcomm’s senior vice president. 

“Coming soon, we will be expanding our portfolio of IoT products to address high-performance, industrial-grade solutions that will bring a new era of intelligence, functional safety, and robust high-performance compute and I/O capabilities to the most demanding industrial applications.”

Qualcomm is also showcasing its new Wi-Fi system specifically designed for IoT connectivity, the Qualcomm QCC730 at the event. 

According to Qualcomm, its new WiFi system provides up to 88% lower power than previous generations, and can “revolutionize” products in battery-powered industrial, commercial and consumer applications. 

“Complementing high-performance, low-latency wireless connectivity solutions, Qualcomm QCC730 enabl[es] Wi-Fi for the world of battery-powered IoT platforms,” said Rahul Patel, Qualcomm’s group general manager. “This new offering places Qualcomm at the center of next-generation battery-powered smart-home, healthcare, gaming and other consumer electronic devices.”

Embedded World visitors can also see Qualcomm’s portfolio of software solutions demonstrated in other companies’ hardware products at the event, spanning sectors such as robotics, manufacturing, asset and fleet management and automotive solutions.